Electroless copper depositing processess are controlled by the kinetics of formal dehyde oxidation reaction, which donate electron for the cathodic reduction of cupric ions.
Electroless copper depositing processess are controlled by the kinetics of formal dehyde oxidation reaction, which donate electron for the cathodic reduction of cupric ions.
摘要化学镀铜反应受甲醛氧化过程动力学控制，甲醛氧化为铜离子还原提供电子。