OEICs (contd.) : Approaches to integration and current state-of-the-art. Epitaxial stacks, multiple-epitaxial runs, epitaxy on processed electronics (GaAs-on-Si, GaAs-on-GaAs, Si-on-GaAs). Bonding. Hybrid integration. Self-assembly.
OEICs (contd.) : Approaches to integration and current state-of-the-art. Epitaxial stacks, multiple-epitaxial runs, epitaxy on processed electronics (GaAs-on-Si, GaAs-on-GaAs, Si-on-GaAs). Bonding. Hybrid integration. Self-assembly.
25光电整合回路(续)：整合的方式与目前最先进的方式。磊晶叠块，多次磊晶，在有电子元件的基板上磊晶(砷化镓在矽基板上，砷化镓在砷化镓基板上，矽在砷化镓基板上)。晶圆键结。异质整合。自我组装。