For a wafer bumping stencil, the cutting technology must be capable of producing thousands of small, closely spaced apertures to extremely tight dimensional and positional tolerances.
For a wafer bumping stencil, the cutting technology must be capable of producing thousands of small, closely spaced apertures to extremely tight dimensional and positional tolerances.
对于晶片凸起钢网，切割技术应能够生产尺寸和位置要求极其严的好几千小而密的孔。