For applications with pitches below 0.5 mm, choices are limited to laser cutting or electroforming.
For applications with pitches below 0.5 mm, choices are limited to laser cutting or electroforming.
制造过程电抛光和电镀处理的激光刻录的孔壁，改善了锡膏转移的效果。
For applications with pitches below 0.5 mm, choices are limited to laser cutting or electroforming.
制造过程电抛光和电镀处理的激光刻录的孔壁，改善了锡膏转移的效果。