Integrates circuit devices are mounted on one or both surfaces of the circuit module those multi-layer structure is divided into three types of integration regions including inter-connection integration regions, basic passive device integration regions an
Integrates circuit devices are mounted on one or both surfaces of the circuit module those multi-layer structure is divided into three types of integration regions including inter-connection integration regions, basic passive device integration regions an
积体电路元件安装在电路模组的一或两层的表层，其多层结构分成三种整合区域，包含内部接线整合区域、基本被动元件整合区域和高频被动元件整合区域。