Abstract: Abstract：The status and trend of the IC failure analysis technology in China was reviewed with practical cases，including nondestructive failure analysis，signal tracing，secondary effect，sample preparation and back side failure location.
Abstract: Abstract：The status and trend of the IC failure analysis technology in China was reviewed with practical cases，including nondestructive failure analysis，signal tracing，secondary effect，sample preparation and back side failure location.
摘要：摘要：通过实例综述了目前国内集成电路失效分析技术的现状和发展方向，包括：无损失效分析技术、信号寻迹技术、二次效应技术、样品制备技术和背面失效定位技术，为进一步开展这方面的工作提供参考。