The diffusion welding behavior of single-crystalline Cu to single-crystalline α-AIO with a Nb film interlayer and the joint microstructure properties were studied by TEM,SEM/EDS analyses and four-point bend testing.The Nb film interlayer deposited by elec
The diffusion welding behavior of single-crystalline Cu to single-crystalline α-AIO with a Nb film interlayer and the joint microstructure properties were studied by TEM,SEM/EDS analyses and four-point bend testing.The Nb film interlayer deposited by elec
扩散连接技术是一门边缘科学，涉及材料、扩散、相变、界面反应、接头应力应变等各种行为，工艺参数多，虽然已经进行了大量的试验研究，但却对各种材料的连接机理尚未有明确的认识，为此人们试图借助于计算技术，对接头行为进行数值模拟，以便找到共同规律，对扩散连接过程及质量进行预测与实时控制。