It is concluded that through the examples of stencil printing and electroplating wafer bumping describe the current status of lead-free alternatives for advanced interconnection technology,reliable lead-free technologies are available.
It is concluded that through the examples of stencil printing and electroplating wafer bumping describe the current status of lead-free alternatives for advanced interconnection technology,reliable lead-free technologies are available.
从而说明，通过漏印板印刷和电镀的晶圆片凸点形成技术事例，证明可靠的无铅化技术是适合的。